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TI's 2013 Intern Design Challenge Announced

Every year, interns spending their summers at Texas Instruments are challenged to test their creativity, technical prowess & might in a competitive design challenge based on TI technology. This year, we are challenging our interns to create a solution based on a TI MCU LaunchPad or the new BeagleBone Black.

The Challenge

Choose your own adventure (i.e. development platform):

  • MSP430G2553 LaunchPad
  • Tiva C TM4C123 LaunchPad
  • C2000 TMS320F2027 LaunchPad
  • Sitara AM335x-based BeagleBone Black


Design & build a plug-in module for your chosen platform

  • Create a BoosterPack for the LaunchPad or a Cape for the BeagleBone Black!
  • Your design should be original, mind-blowing, useful and/or just-plain-awesome!




  • The winning team in each category will win $750!
  • Chance to have your design productized!
  • Get a picture with Mr. Rich Templeton, the TI CEO and all-around great guy!
  • Get a wafer autographed by Rich!
  • Featured on TI Blogs and mentioned on TI social media channels!



  • LaunchPad BoosterPack People's Choice
  • LaunchPad BoosterPack Best Technical Design
  • BeagleBone Cape People's Choice
  • BeagleBone Cape Best Technical Design

For more information on this Design Challenge and its winners, please visit TI Design 2013

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